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???? www.ark-micro.com 2009.03 1/11 FTP08N50/fta08n50 500v n mos ? ? ? ??? ? ?? ( ?? 33nc) ? ?? ? 100% ? ? rohs ? / ?? ?? ? ??? ? / ? ? ? ?? ?? ? FTP08N50 to-220 FTP08N50 fta08n50 to-220f fta08n50 ? ?? t c =25 FTP08N50 fta08n50 v dss ? - ?? [1] 500 v i d ?? t c =25 8.0 8.0* i d @100 ?? t c =100 figure 3 i dm ?? [2] figure 6 a ? t c =25 125 31 w p d ?? t c 25 1.0 0.25 w/ v gs ? - ?? 30 v e as ? l=7mh, i d =8.0a 220 mj dv/dt ?? dv/dt ? [3] 4.5 v/ns t l ? ( ? 1.6mm 10 ) 300 t j t stg o?? -55 to 150 * ??? ??????????????? FTP08N50 fta08n50 r jc - ? 1.0 4.0 r ja - 60 60 /w bv dss r ds(on) (max.) i d 500v 0.9 ? 8.0a www.datasheet.co.kr datasheet pdf - http://www..net/
???? www.ark-micro.com 2009.03 2/11 FTP08N50/fta08n50 ? ?? t c =25 ? ? ? bv dss ? - ?? 500 -- -- v v gs =0v, i d =250a bv dss / t j ??? -- 0.6 -- v/ 25 ? , i d =250a -- -- 12 v ds =500v, v gs =0v i dss ? - ?? -- -- 100 a v ds =400v, v gs =0v, t c =125 -- -- 100 v gs =+30v i gss ? - ?? -- -- -100 na v gs =-30v ? ? ? t c =25 ? ? ? r ds(on) ? - ?? -- 0.75 0.9 ? v gs =10v, i d =4.8a [4] v gs(th) ??? 2.0 -- 4.0 v v ds = v gs , i d =250a gfs -- 7.9 -- s v ds =15v, i d =8.0a [4] ? ??? ? ? ? c iss -- 1110 -- c oss -- 101 -- c rss -- 21 -- pf v gs =0v v ds =25v f=1.0mh z figure 14 q g ?? -- 33 -- q gs ? - ? -- 3.2 -- q gd ? - ?? -- 12.5 -- nc v dd =250v i d =8.0a figure 15 ??? ? ? ? t d(on) ?? -- 31 -- t rise ? -- 72 -- t d(off) ??? -- 74 -- t fall ?? -- 51 -- ns v dd =250v i d =8.0a v gs =10v r g =20 ? www.datasheet.co.kr datasheet pdf - http://www..net/
???? www.ark-micro.com 2009.03 3/11 FTP08N50/fta08n50 ? ? t c =25 ? ? ? i sd -- -- 8.0 a i sm -- -- 32 a integral p-n diode in mosfet v sd ? -- -- 1.2 v i s =8.0a, v gs =0v t rr ?? -- 320 -- ns q rr ? -- 1980 -- nc v gs =0v i f =8.0 a,di/dt=100a/s ?? [1] t j =+25 to +150 [2] ???? [3] i sd =8.0a, di/dt 100a/s, v dd bv dss , t j =+150 [4] 380s; ?? 2%. www.datasheet.co.kr datasheet pdf - http://www..net/
???? www.ark-micro.com 2009.03 4/11 FTP08N50/fta08n50 figure 1. maximum effective thermal impedance, junction-to-case 0.001 0.01 0.1 1 1.0e-06 1.0e-05 1.0e-04 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.0e+01 t p , rectangular pulse duration(s) z jc , thermal impedance(normalized ) single pulse 1% 2% 5% 10% 20% 50% figure 2. maximum power dissipation vs. case temperature 0 20 40 60 80 100 120 140 25 50 75 100 125 150 t c , case temperature ( ) p d , power dissipation (w) figure 3. maximum continuous drain current vs case temperature 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 25 50 75 100 125 150 t c , case temperature ( ) i d , drain current (a) figure 4. typical output characteristics 0 5 10 15 20 25 30 35 0 1020304050 vds, drain-to-source voltage(v) id, drain current(a) vgs=4.0v vgs=4.5v vgs=5.0v vgs=5.5v vgs=6.5v vgs=1 5 v vgs=1 0 v figure 5. typical drain-to-source on resistance vs. gate voltage and drain current 0.5 1 1.5 2 2.5 3 4 6 8 101214161820 v gs , gate-to-source voltage(v) r ds(on) , drain-to-source on resistance(ohm) id=4a id=8a www.datasheet.co.kr datasheet pdf - http://www..net/
???? www.ark-micro.com 2009.03 5/11 FTP08N50/fta08n50 figure 6. maximum peak current capability 1 10 100 0.00001 0.0001 0.001 0.01 0.1 1 10 t p , pulse width(s) i dm , peak current(a) transconductance may limit current in this region figure 7. typical transfer characteristics 0 5 10 15 20 25 345678 v gs , gate-to-source voltage,(v) i d , drain-to-source current (a) -55 25 150 figure 8. unclamped inductive switching capability 0.1 1 10 100 1.e-06 1.e-05 1.e-04 1.e-03 1.e-02 1.e-01 t av , time in avalanche(s) i as , avalanche current(a ) starting tj=25 starting tj=150 figure 9. typical drain-to-source on resistance 0.6 0.7 0.8 0.9 1 1.1 0 5 10 15 20 i d , drain current(a) r ds(on) , drain-to-source on resistance(ohm) vgs=1 0 v vgs=2 0 v figure 10. typical drain-to-source on resistance vs. junction temperature 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 -75 -50 -25 0 25 50 75 100 125 150 t j , junction temperature ( ) r ds(on) , drain-to-source resistance (normalized) www.datasheet.co.kr datasheet pdf - http://www..net/
???? www.ark-micro.com 2009.03 6/11 FTP08N50/fta08n50 figure 11.typical breakdown voltage vs. junction temperature 0.90 0.95 1.00 1.05 1.10 1.15 1.20 -50 -25 0 25 50 75 100 125 150 t j , junction temperature ( ) bv dss , drain-to-source breakdown voltage (normalized ) figure 12.typical threshold voltage vs. junction temperature 0.7 0.8 0.9 1.0 1.1 1.2 1.3 -50 -25 0 25 50 75 100 125 150 t j , junction temperature ( ) v gs(th) threshold voltage (normalized) figure 13. maximum forward safe operation area 0.1 1 10 100 10 100 1000 vds, drain-to-source voltage(v) id, drain current(a) dc 10ms 1ms 100us 10us operating in this area may be limited by rds(on) figure 14. typical capacitance vs. drain-to-source voltage 1 10 100 1000 10000 0.01 0.1 1 10 100 1000 v ds , drain voltage(v) c, capacitance(pf) ciss coss crss figure 15. typical gate charge vs. gate-to-source voltage 0 2 4 6 8 10 12 0 5 10 15 20 25 30 35 q g , gate charge(nc) v gs . gate-to-source voltage(v ) figure 16. typical body diode transfer characteristics 0 10 20 30 40 50 60 0.25 0.5 0.75 1 1.25 1.5 1.75 2 v sd , source-to-drain voltage(v) i sd , reverse drain current(a) 150 25 -55 www.datasheet.co.kr datasheet pdf - http://www..net/
???? www.ark-micro.com 2009.03 7/11 FTP08N50/fta08n50 ? www.datasheet.co.kr datasheet pdf - http://www..net/
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???? www.ark-micro.com 2009.03 11/11 FTP08N50/fta08n50 ark microelectronics co., ltd. reserves the right to make change without notice in order to improve reliability, function or design and to discontinue any product or service without notice. customers should obtain the latest relevant information before orders and should verify that such in formation is current and complete. all products are sold subject to ark microelectronics co., ltd?s terms and conditions supplied at the time of order acknowledgement. ark microelectronics co., ltd. warrants performance of its hardware products to the specifications at the time of sale, testing, reliability and quality control are used to the extent ark microelectronics co., ltd deems necessary to support this warra ntee. except where agreed upon by co ntractual agreement, testing of all parameters of each product is not necessary performed. ark microelectronics co., ltd. does not assume any liability arising from the use of any product or circuit designs described herein. customers are responsible for their products and applications using ark microelectronics co., ltd?s components. to minimize risk, customers must provide adequate design and operating safeguards. ark microelectronics co., ltd. does not warrant or convey any license either expressed or implied under its patent rights, nor the rights of others. reproduction of information in ark microelectronics co., ltd?s data sheets or data books is permissible only if reproduction is without modification or alteration. reproduction of this information with any alteration is an unfair and deceptive business practice. ark microelectronics co., ltd is not responsible or liable for such altered documentation. resale of ark microelectronics co., ltd?s products with statements different from or beyond the parameters stated by ark microelectronics co., ltd. for the product or service voids all express or implied warrantees for the associated ark microelectronics co., ltd?s product or service and is unfair and deceptive business practice. ark microelectronics co., ltd is not responsible or liable for any such statements. life support policy: ark microelectronics co., ltd?s products are not authoriz ed for use as critical components in life devices or systems without the expressed written approval of ark microelectronics co., ltd. as used herein: 1. life support devices or systems are devices or systems which: a. are intended for surgical implant into the human body, b. support or sustain life, c. whose failure to perform when properly used in accor dance with instructions for used provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. a critical component is any component is any co mponent of a life support device or system whose failure to perform can be reasonably expected to cause the fail ure of the life support devi ce or system, or to affect its safety or effectiveness. ???? ???? 53 ??? 1 1e +86-28-85232215 +86-28-85256679 www.datasheet.co.kr datasheet pdf - http://www..net/

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